EnShape at the Automatica 2016 in Munich

 In Trade Fairs

We will show you a very challenging application at the Automatica 2016. In our exhibit we will detect and grip unsorted products (Bin Picking) out of a box in a very high rate. Furthermore, we present you the compact 3D sensor system Inspect 20, which was developed for quality assurance in the millisecond range.

We invite you to visit us at our booth at the Automatica

Hall A5 Booth 139C
Messe München (at the East Entrance)

We look forward to answer your questions and discuss potential applications with you. We are looking forward to your visit!

Furthermore you can find the 3D solutions of EnShape in action at the booths of our partners.

DENSO Robotics Europe / DENSO Europe B.V.
Hall B5 Booth 311

IBG Automation GmbH
Hall A4 Booth 421

IPR Intelligente Peripherien für Roboter GmbH
Hall A5 Booth 317

Recent Posts
Contact Us

Just write us, we will get back to you as soon as possible.

Not readable? Change text.